To provide a method of probe inspection that is superior in accuracy of the inspection.

Test patterns T, each having electrodes to which the head of a probe is contacted, are formed on a wafer W. When an inspection result indicating that a chip has a defect in electrical characteristics is repeated ten times continuously, whether the cause is due to adhesion or attachment of an insulating substance on the probe head or not is judged by conducting a needle-point test using the test pattern T. If the cause is judged to be due to adhesion or attachment of an insulating substance on the probe head, the probe inspection is conducted again on the ten chips, after cleaning the probe head.