Title:
CHUCKING MECHANISM OF PROBER
Document Type and Number:
Japanese Patent JP2001210683
Kind Code:
A
Abstract:
To provide the chucking mechanism of a prober that can inspect a semiconductor device by accurately and quickly setting the temperature to the use environment temperature of the device.
The chucking mechanism 2 of the prober has a chucking unit 21 that holds wafer, where the surface of the chuck unit is divided into a plurality of regions. Each region has an independent heating/cooling mechanism 23 and a temperature sensor 24. The temperature in each region is managed, by receiving the result of the detection by the sensor in the region and controlling the heating/cooling mechanism in the region. Consequently, the temperature of the semiconductor device under measurement can be set accurately.
Inventors:
CHIBA KIYOTAKA
Application Number:
JP2000016256A
Publication Date:
August 03, 2001
Filing Date:
January 25, 2000
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD
International Classes:
G01R1/06; H01L21/66; H01L21/68; H01L21/683; G01R31/28; (IPC1-7): H01L21/66; G01R1/06; G01R31/28; H01L21/68
Attorney, Agent or Firm:
Takashi Ishida (4 others)
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