PURPOSE: To cure a coating at a high temperature by fixing an electronic component to a metallic layer, electrically connecting an output terminal to a predetermined position of the layer, accommodating to fix the component and connections to a cavity of a card, and dividing the metallic layer into a plurality of zones.

CONSTITUTION: An electronic component 21 is fixed to a metallic layer 20, and its output terminal 23 is connected to predetermined connection positions of the layer 20 via conductive wires 24. It is then resin coated. Then, this unit is turned over, and the component 21, the wires 24 and the positions 25 are accommodated in a cavity 31 of a card 30. Accordingly, a periphery of the layer 20 is brought into contact with an upper surface of the card 30 surrounding the cavity 31, and fixed. Then, the layer 20 is divided into a plurality of contact zones including the electrically insulated positions 25. According to this method, since a support film is not used, resin coating can be cured at a high temperature, and operating time is shortened.