Title:
METHOD FOR MANUFACTURING ADHESIVE APPLIED POLYIMIDE FILM
Document Type and Number:
Japanese Patent JP2013075255
Kind Code:
A
Abstract:
To provide a method for manufacturing an adhesive applied polyimide film reduced in the residual amount of a solvent for manufacturing a metal laminate free from wrinkles/faults.
After a heat-resistant polyimide film is coated with a solution containing polyamic acid and a solvent, the coated film is treated at temperature equal to or above the boiling point of the solvent to manufacture the adhesive applied polyimide film. This treatment step of the coated film has a step of bringing the heat-resistant polyimide film into contact with a heating roll for 0.2-10 s.
Inventors:
NISHIYAMA TAKESHI
YAMADA HIROYUKI
KAWAZU NARIAKI
YAMADA HIROYUKI
KAWAZU NARIAKI
Application Number:
JP2011216288A
Publication Date:
April 25, 2013
Filing Date:
September 30, 2011
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
B05D7/24; B05D3/02; B32B27/34; C09J7/02; H05K1/03
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