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Title:
METHOD FOR MANUFACTURING ADHESIVE APPLIED POLYIMIDE FILM
Document Type and Number:
Japanese Patent JP2013075254
Kind Code:
A
Abstract:

To provide a method for manufacturing an adhesive applied polyimide film capable of taking up the adhesive applied polyimide film without generating wrinkles, not requiring the stretching process in the TD direction immediately before lamination and capable of manufacturing a metal laminate free from wrinkles/faults.

After a heat-resistant polyimide film with a thickness of 1-12 μm is coated with a solution containing polyamic acid and a solvent, the coated film is treated at temperature equal to or above the boiling point of the solvent; the obtained film is stretched in its width direction by rolls, and immediately thereafter taken up as the adhesive applied polyimide film.


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Inventors:
NISHIYAMA TAKESHI
YAMADA HIROYUKI
OKAMOTO KAZUYUKI
Application Number:
JP2011216287A
Publication Date:
April 25, 2013
Filing Date:
September 30, 2011
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
B05D7/24; B05D3/12; B05D7/04; B32B27/34; C09J7/02; C09J11/06; C09J179/08



 
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