Title:
METHOD OF MANUFACTURING CERAMIC MEMBER FOR HOLDING WAFER
Document Type and Number:
Japanese Patent JP2001274227
Kind Code:
A
Abstract:
To provide a method of manufacturing a ceramic member for holding a wafer suitable as a member for conveying, holding or the like a semiconductor wafer, an LCD glass substrate, a magnetic disc substrate, etc.
In this method of manufacturing a ceramic member for holding a wafer, a protrusion is formed at a prescribed position of a ceramic substrate by sandblasting method and an edge portion of an end of the protrusion is finished in a curved surface. The edge portion of the protrusion end is finished in a curved surface by barrel finishing.
Inventors:
SHIMODA SHUICHIRO
IWAI AKIHITO
IWAI AKIHITO
Application Number:
JP2000090684A
Publication Date:
October 05, 2001
Filing Date:
March 27, 2000
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B24C1/04; B24B31/00; H01L21/68; H01L21/683; (IPC1-7): H01L21/68; B24B31/00; B24C1/04
Domestic Patent References:
| JPH10308643A | 1998-11-17 | |||
| JPH09283605A | 1997-10-31 | |||
| JPH08139169A | 1996-05-31 | |||
| JPH10242255A | 1998-09-11 |
Attorney, Agent or Firm:
Kunihiko Wakabayashi