Title:
METHOD FOR MANUFACTURING CHIP COMPONENT
Document Type and Number:
Japanese Patent JP3766663
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a chip component wherein mass production is enabled efficiently and high dimensional accuracy can be realized.
SOLUTION: The chip component has a conductor arranged on an insulating substrate, and a pair of electrodes connected to the conductor. The method for manufacturing it is provided with a process for preparing a taking many pieces insulating substrate having first splitting grooves which are formed by a method wherein embossing of a first splitting groove pattern is performed to an insulating sheet and calcination is performed, a process for working and forming second splitting grooves which are almost perpendicular to the first splitting grooves on the taking many pieces insulating substrate, and a process wherein the conductors and the electrodes are formed on the taking many pieces insulating substrate and dividing is performed along the first and the second splitting grooves. As a result, miniaturization and high dimensional accuracy of the chip component can be realized while reducing time and cost in a manufacturing process.
Inventors:
Kentaro Matsumoto
Application Number:
JP2003110189A
Publication Date:
April 12, 2006
Filing Date:
April 15, 2003
Export Citation:
Assignee:
KOA Corporation
International Classes:
H01C17/06; (IPC1-7): H01C17/06
Domestic Patent References:
| JP63041003A | ||||
| JP8130107A | ||||
| JP2002313613A |
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