To provide a method of manufacturing circuit components, by which the efficiency of mask removing work is improved and the accurate outline of a pattern can be reproduced easily along a mask.

After an insulating substrate 1 is formed, a conductor layer 2 is formed on the whole surface of the substrate 1. Of the surface of the substrate 1, the portion in which conductive layers 4 are to be formed in a prescribed pattern is exposed and a resin mask of a poly-lactic acid, etc., is integrally formed on the exposed surface of the substrate 1. In addition, the conductor layers 4 are formed in laminated states on the surface of the substrate 1 exposed from the mask 3 by electroplating the exposed substrate with an acidic bath composition. Since the mask 3 and plated metal are simply closely adhered to each other in the interface between the mask 3 and conductor layers 4, the accurate outline of the pattern can be reproduced along the mask 3. Thereafter, the mask 3 is removed with an aqueous alkaline solution. Finally, the conductor layers 4 are formed in a prescribed pattern on the surface of the substrate by chemically etching off the conductor layers 2.