Title:
METHOD OF FORMING FILM AND METHOD OF MANUFACTURING PRINTED BOARD
Document Type and Number:
Japanese Patent JP2002344115
Kind Code:
A
Abstract:
To prevent the quality of a formed aluminum film from changing by moisture, an unreacted monomer, a solvent, an additive, etc., evaporated or scattered from an adhesive or flexible printed board to which the aluminum film is stuck with adhesive at the time of forming a metallic film on the printed board by sputtering, vapor deposition, etc.
The scattering of the moisture, unreacted monomer, solvent, etc., is prevented by covering the scattering sources of the moisture, monomer, solvent, etc., with masks 4.
Inventors:
FUKUSHIMA TETSUO
MATSUMOTO HIDEO
NAKAGAMI YUICHI
SEIKE TOMOKAZU
MATSUMOTO HIDEO
NAKAGAMI YUICHI
SEIKE TOMOKAZU
Application Number:
JP2001146191A
Publication Date:
November 29, 2002
Filing Date:
May 16, 2001
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
C23C14/04; H05K3/14; (IPC1-7): H05K3/14; C23C14/04
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)
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