WIRING BOARD AND ITS MANUFACTURING METHOD

Japanese Patent JP2002344114

A

To provide a wiring board in which unreinforced portions and troubles caused by partial strength drops hardly occur at the time of forming recessed sections in a wiring pattern, and to provide a method of manufacturing the board.

In the method of manufacturing the wiring board, the recessed sections 15 are formed in the wiring pattern by arranging a top force C and a bottom force D in which different wiring patterns are respectively formed in protruding states on both surfaces of a resin board 11 having through holes 12 filled up with conductive paste 13 and maintained in a prepreg-state and curing the board 11 by pressing the forces C and D against the board 11 while the forces C and D are heated. Thereafter, wiring pattern conductors 16 composed of conducive paste, etc., are packed in the recessed sections 15 and the surfaces of the board 14 and conductors 16 are flattened. In this method, a porous film of a heat-resistant resin is used as the reinforcing material of the board 11.

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KAWASHIMA TOSHIYUKI
TAWARA SHINJI
IKEDA KENICHI

JP2001143078A

November 29, 2002

May 14, 2001

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NITTO DENKO CORP

H05K3/40; H05K3/10; H05K3/46; (IPC1-7): H05K3/10; H05K3/40; H05K3/46

Takao Suzuki (4 others)

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