Title:
ELECTRONIC CIRCUIT BOARD AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2002344113
Kind Code:
A
Abstract:
To provide an electronic circuit board in which a serial number or ID information can be recorded inexpensively with little effort and from which the recorded serial number or ID information can be read out easily.
This module board 10 is provided with a CPU(central processing unit) 11 which executes a prescribed function of the board 10, a wiring area 12 having a wiring pattern 12a used for storing the serial numbers which is the manufacture's serial number of the board 10 or ID information, and an interface circuit 13 which enables the CPU 11 to refer to the wiring pattern 12a of the wiring area 12. The board 10 is also provided with fixed wiring 14 drawn into the wing area 12 from the interface circuit 13.
Inventors:
MIURA HIROTSUNA
Application Number:
JP2001147334A
Publication Date:
November 29, 2002
Filing Date:
May 17, 2001
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B41J2/01; H01L23/12; H05K1/02; H05K3/10; (IPC1-7): H05K3/10; B41J2/01; H01L23/12; H05K1/02
Attorney, Agent or Firm:
Mutsumi Yanase (3 outside)