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Patent Searching and Data


Title:
WIRING DEVICE AND METHOD OF MANUFACTURING HIGHLY DENSELY MULTI-WIRED WIRING BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2002344112
Kind Code:
A
Abstract:

To provide a wiring device that can increase the supply amount of a wire by only detecting wire crossing sections, and to provide a method of manufacturing a multi-wired wiring board on which wires can be laid at a high density without causing failures, such as large wire deformation, etc.

The wiring device is constituted by adding a height detecting section which detects the height of a stylus and a control section which controls the supply amount of an insulated and covered wire to the conventional wring device. When the height detecting section detects a wire crossing section from the height change of the stylus, the amount of the wire is increased to 1.1 to 1.5 times the amount supplied when no wire crossing section exists based on the signal of the control section.


Inventors:
TAKAHASHI ATSUSHI
TSUKADA KAZUNARI
KASHIWAZAKI MASAMI
Application Number:
JP2001143149A
Publication Date:
November 29, 2002
Filing Date:
May 14, 2001
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H05K3/10; (IPC1-7): H05K3/10
Attorney, Agent or Firm:
Hidekazu Miyoshi (8 outside)