Title:
METHOD FOR MANUFACTURING IC MODULE AND IC MODULE, AND IC CARD
Document Type and Number:
Japanese Patent JP2003007742
Kind Code:
A
Abstract:
To provide an IC module for an IC card capable of reducing physical failure due to a bent of the IC card and to provide the IC card.
A method for manufacturing the IC module comprises the steps of mounting a connecting wire of an IC chip 14 at a substrate 12, then dropping a sealing resin on the chip 14 and the wire on the substrate 12, mounting a jig 22 having a mold releasability before a sealing resin remains uncured, and curing while regulating a height of a sealing resin part. The IC module is manufactured by this method. The IC card in which the IC module is mounted is provided.
Inventors:
OZAKI KATSUMI
Application Number:
JP2001187450A
Publication Date:
January 10, 2003
Filing Date:
June 21, 2001
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B42D15/10; G06K19/077; H01L21/56; H01L23/28; (IPC1-7): H01L21/56; B42D15/10; G06K19/077; H01L23/28
Attorney, Agent or Firm:
Satoshi Kanayama
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