To provide a method for manufacturing a semiconductor integrated circuit package capable of safely and efficiently executing a step of dicing of manufacturing steps of the integrated circuit package.

The method for manufacturing the semiconductor integrated circuit package comprises a step of mounting a plurality of integrated circuit chips 2 on a mounting board 1, a step of electrically connecting each chip 2 to a predetermined terminal on the board 1 by wiring, a step of molding the plurality of wired chips 2 by a molding resin, and a step of adhering a UV tape 6 to the board 1 by opposing a protrusion 7 of the tape 6 in which the protrusions 7 substantially equal to a thickness of the molding resin 5 are formed, to a part corresponding to an outer periphery in which the resin 5 is not provided on the board 1.