To reduce variations in thicknesses of translucent synthetic resins 12 and 33 when coating light emitting diode chips 1 and 21 except for n-electrodes 6 and 25 and p-electrodes 7 and 26, by the translucent synthetic resins 12 and 33 containing the powder of a fluorescent material.
Many of the light emitting diode chips 1 and 21 are so bonded to sheets 8, 28, and 29 that the n-electrodes 6 and 25 and the p-electrodes 7 and 26 may be close to the sheets. Then, the sheets are filled up with the translucent synthetic resin containing the powder of a fluorescent material in a liquid state, and then the translucent synthetic resin is hardened to make the sheets into resin plates 10 and 31. The resin plates are diced by cutting portions between the individual light emitting diode chips by a cutting width S narrower than the intervals L between the side faces of the individual light emitting diode chips.
Tadashi Higashino
Hiroyuki Nishi
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