Title:
MOLD FOR FORMING FINE PATTERN AND ITS PRODUCTION PROCESS
Document Type and Number:
Japanese Patent JP2005327788
Kind Code:
A
Abstract:
To provide a mold for forming a high precision fine pattern on the surface of a semiconductor with high productivity, and to provide its production process.
In the mold 7 for forming a fine pattern having protrusions and recesses 11d and 11e on the surface of a mold body 11c for transferring a fine pattern to the surface of a semiconductor substrate, the mold body being provided with the protrusions and recesses 11d and 11e is formed of silica glass, and a thin film 15a having photocatalytic action is formed on the surface of the mold 11c on the side of protrusions and recesses 11d and 11e. Its production process is also provided.
Inventors:
KOMANO HARUYASU
Application Number:
JP2004142263A
Publication Date:
November 24, 2005
Filing Date:
May 12, 2004
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
G03F7/20; H01L21/027; (IPC1-7): H01L21/027; G03F7/20
Attorney, Agent or Firm:
Nobuo Kinutani