Title:
METHOD FOR MANUFACTURING MULTI-LAYER CHIP CARD, AND MULTI-LAYER CHIP CARD
Document Type and Number:
Japanese Patent JP2023070191
Kind Code:
A
Abstract:
To improve the appearance of an outer face of a chip card with a core layer structure (2).SOLUTION: The method for manufacturing a multi-layer chip card includes the steps of: providing a core layer structure (2) having a front face and a rear face; providing a front side layer structure (1) to the front face of the core layer structure (2); providing a rear side layer structure (3) to the rear face of the core layer structure (2); providing a label (50) between the rear side layer structure (3) and the core layer structure (2); laminating the front side layer structure (1), the core layer structure (2) and the rear side layer structure (3) which are stacked, including the label (50) positioned between the core layer structure (2) and the rear side layer structure (3) by heating and pressurizing a stack. An IC chip (10) does not overlap a contact pad (20) when viewed from the front side to the rear side. When viewed from the front side to the rear side, the label (50) overlaps the contact pad (20).SELECTED DRAWING: Figure 1
Inventors:
WANG DUN PU
MILENA NIEDERNHUBER
MILENA NIEDERNHUBER
Application Number:
JP2022178813A
Publication Date:
May 18, 2023
Filing Date:
November 08, 2022
Export Citation:
Assignee:
GIESECKE DEVRIENT MOBILE SECURITY GMBH
International Classes:
G06K19/077; H05K3/46
Attorney, Agent or Firm:
Masafumi Yanagida
Hideaki Takahashi
Hideaki Takahashi