Title:
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2014142729
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve the reliability of reading a code formed on a semiconductor device.SOLUTION: A method of manufacturing a semiconductor device in an embodiment includes a step of evaluating the identification property of a code M2 of an inspection object for a semiconductor chip, a sealing body that seals the semiconductor chip, and the inspection object that has the code M2 which is formed on the sealing body. Evaluation items for an evaluation criterion for evaluating the identification property include the evaluation of a difference between the average luminance value of a bright cell CL2 and the average luminance value of a dark cell CL1.
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Inventors:
MINETA TOKUAKI
Application Number:
JP2013009705A
Publication Date:
August 07, 2014
Filing Date:
January 23, 2013
Export Citation:
Assignee:
RENESAS ELECTRONICS CORP
International Classes:
G06K5/00; G06K1/12; G06K7/10; H01L23/00; H01L23/28
Domestic Patent References:
| JP2010538339A | 2010-12-09 | |||
| JP2011066340A | 2011-03-31 | |||
| JP2006321216A | 2006-11-30 | |||
| JPH01185372A | 1989-07-24 |
Other References:
JPN6016018766; Ａｓｓｏｃｉａｔｉｏｎ ｆｏｒ Ａｕｔｏｍａｔｉｃ Ｉｄｅｎｔｉｆｉｃａｔｉｏｎ ａｎｄ Ｍｏｂｉｌｉｔｙ: 'Ｄｉｒｅｃｔ Ｐａｒｔ Ｍａｒｋ （ＤＰＭ） Ｑｕａｌｉｔｙ Ｇｕｉｄｅｌｉｎｅ' ＡＩＭ Ｇｌｏｂａｌ Ｄｏｃｕｍｅｎｔ： ＡＩＭ ＤＰＭ-１-２００６ , 20061212
Attorney, Agent or Firm:
Yamato Tsutsui
Atsushi Sugada
Akiko Tsutsui
Tetsuya Sakaji
Atsushi Sugada
Akiko Tsutsui
Tetsuya Sakaji