Title:
METHOD FOR MOUNTING SEMICONDUCTOR ELEMENT AND OPTICAL INFORMATION PROCESSING UNIT
Document Type and Number:
Japanese Patent JP3748779
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for mounting a semiconductor element having high quality and high productivity, and to provide a method for manufacturing an optical information processing unit.
SOLUTION: A through-hole 234 is provided at a position corresponding to an external electrode terminal 203 of the semiconductor element, at a thermoplastic or thermosetting sheet 235 used to connect the element to a circuit board.
More Like This:
Inventors:
Tsukahara corporation
Kazushi Higashi
Hiroyuki Otani
Kazushi Higashi
Hiroyuki Otani
Application Number:
JP2001040357A
Publication Date:
February 22, 2006
Filing Date:
February 16, 2001
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60; H01L27/14; H01L25/065; H01L25/07; H01L25/16; H01L25/18; H01L27/15; H01L31/02; H01L33/08; H01L33/58; H05K3/32; (IPC1-7): H01L21/60; H01L25/065; H01L25/07; H01L25/18; H01L25/16; H01L27/14; H01L27/15; H01L31/02; H01L33/00; H05K3/32
Domestic Patent References:
| JP4345041A | ||||
| JP4354040A |
Attorney, Agent or Firm:
Aoyama Aoi
Osamu Kawamiya
Mitsuo Wada
Osamu Kawamiya
Mitsuo Wada