METHOD OF PEELING PRESSURE-SENSITIVE ADHESIVE FROM WAFER HOLDER

Japanese Patent JPH01171238

A

PURPOSE:To enable a pressure-sensitive adhesive to be peeled off easily also from the corners of a wafer holder, by scraping off the surfaces of projections opposing to a wafer holder to reduce height thereof, and providing spacers vertically on the respective projections while providing spacers having positioning pins vertically on the respective projections, so that an area irradiated with UV rays of the regions where the wafer holder is applied against a chamber is enlarged. CONSTITUTION:Surfaces of projections 11-14 opposing to a wafer holder are scraped off to reduce height thereof and spacers 7, 8 are provided vertically on two of the projections 11-14, namely on the projections 13 and 14 while spacers 5, 6 having wafer positioning pins are provided vertically on the other projections 11 and 12. Thereby, gaps are defined in regions where the wafer holder 1 is applied against a chamber 2. Such gaps are used to reflect an ultraviolet ray repeatedly and to enlarge an area irradiated with the ultraviolet ray. The ultraviolet ray as indicted by the arrow UV is reflected repeatedly within the gap as indicated by the multiple arrows and reaches even the edges of the wafer holder 1. The same effect can be obtained also in the gap defined by the spacer having positioning pin 6 and the spacer 7. The regions which can not be irradiated with UV light is reduced to the area where the spacers are applied against the wafer holder 1 and, therefore, pressure- sensitive adhesive adhered on the wafer holder 1 is also reduced in amount and can be peeled off easily.

IIJIMA NOBUO
SHIRAI HIDENOBU

JP33326787A

July 06, 1989

December 25, 1987

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FUJITSU LTD
FUJITSU VLSI LTD

H01L21/67; H01L21/68; H01L21/683; (IPC1-7): H01L21/68

Sadaichi Igita

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