To provide a method of protecting a wafer against contamination in a wafer manufacturing process in a semiconductor manufacturing factory (fab).
In an example, this method is set consistent with a manufacture control system (Manufacturing Execution System, MES) of a wafer manufacturing facility. The method comprises a first process of specifying a contamination source manufacturing process, and a second process of defining improving measures following the contamination source manufacturing process. The method traces the manufacturing process records of wafers in the semiconductor manufacturing factory (fab), and the wafers are displayed after the wafer contamination source manufacturing process in which the wafers are contaminated is specified or the improving measures are defined. The manufacture control system (MES) is used to verify and ascertain whether the following improving measures that have been defined are carried out or not after the contamination source manufacturing process where the wafers are contaminated is specified.
YO SHUNKEI
Shingo Nishide
Koichiro Okura