Title:
METHOD FOR PUNCHING RESIN SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
Document Type and Number:
Japanese Patent JP2003220595
Kind Code:
A
Abstract:
To provide a method for punching a resin substrate capable of forming a through hole having a high aspect ratio on the resin substrate by a press processing, and straightly forming the through hole preventing contraction of the hole diameter of the through hole and generation of a resin smear.
The through hole 4 is formed by executing punch action on the resin substrate 1 with a punch 22 of the same diameter at the same position of a die hole 26 a plurality of times using the punch 22 and the die 25.
Inventors:
NAKAMURA TOSHIYUKI
ICHIKAWA MASAHIKO
ICHIKAWA MASAHIKO
Application Number:
JP2002020530A
Publication Date:
August 05, 2003
Filing Date:
January 29, 2002
Export Citation:
Assignee:
SUZUKI CO LTD
International Classes:
B26F1/14; H05K3/00; H05K3/40; (IPC1-7): B26F1/14; H05K3/00; H05K3/40
Attorney, Agent or Firm:
Takao Watanuki (1 outside)
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