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Title:
PATCH BOARD FOR BORING HOLE BY DRILL ON PRINTED CIRCUIT BOARD AND METHOD OF BORING
Document Type and Number:
Japanese Patent JP2003220596
Kind Code:
A
Abstract:

To provide a patch board for boring holes by a drill on a printed circuit board which is excellent in handleability and can improve wall surface roughness of a hole to be bored.

A paper-based thermosetting resin laminate plate with a nonaqueous lubricant comprising a sole substance or a mixture of a polyoxyethylene alkylene block polymer and a polyoxyethylene alkylamine is used as the patch board. The nonaqueous lubricant of the paper-based thermosetting resin laminate plate is specified to be 5 to 100 pts.wt. for the resin, and a total of the nonaqueous lubricant and a thermosetting resin in the resin laminate plate is specified to be in a range of 20 to 80 wt.%.


Inventors:
OHASHI YOSHITAKA
KATO KIKUKO
Application Number:
JP2002014066A
Publication Date:
August 05, 2003
Filing Date:
January 23, 2002
Export Citation:
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Assignee:
RISHO KOGYO KK
International Classes:
B23B41/00; B23B47/00; B26F1/16; H05K3/00; (IPC1-7): B26F1/16; B23B41/00; B23B47/00; H05K3/00
Attorney, Agent or Firm:
Bunji Kamata (2 outside)