Title:
METHOD FOR ROUTING CIRCUIT WIRING IN RESIN-MOLDED PANEL AND VACUUM MOLDING DIE
Document Type and Number:
Japanese Patent JP3922565
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method, for routing circuit wiring in a resin-molded panel, which improves productivity, operating efficiency and the fixed state of the circuit wiring.
SOLUTION: This method comprises a first process, a second process and a third process and routes the circuit wiring l2 in the resin-molded panel l5 simultaneously with the vacuum molding of the panel l5. The first process is used to arrange the circuit wiring l2 to be routed on the upper surface 22 of a circuit wiring routing part l7 protruded on the surface 20 of a base mold l6. The second process is used to wrap the surface 20 of the base mold l6 with a thermally softened panel material l3. The third process is used to suck air trapped between the panel material l3 and the base mold l6 through a notched space l8 and an air suction hole l9.
Inventors:
Naomi Kisu
Emi Soshino
Emi Soshino
Application Number:
JP2003013572A
Publication Date:
May 30, 2007
Filing Date:
January 22, 2003
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
B29C51/10; B29C33/14; B29C51/36; B29C51/12; B29C51/16; H02G3/04; H02G3/30; H02G3/38; B29C51/30; B29L31/34; (IPC1-7): B29C51/10; B29C51/12; B29C51/36; H02G3/04; H02G3/38; //B29L31:34
Domestic Patent References:
| JP8002348A | ||||
| JP9019035A | ||||
| JP9050713A | ||||
| JP10003828A |
Attorney, Agent or Firm:
Yasushi Kobayashi
Akihiro Otsuka
Takeshi Kojima
Akihiro Otsuka
Takeshi Kojima