Title:
METHOD FOR SEALING MICRO PLATE, AND AUTOMATIC SEALING DEVICE FOR MICRO PLATE
Document Type and Number:
Japanese Patent JP3500605
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent generation of troubles at the time of the stacking and the robot operation by correctly positioning a heat bonding film piece on an upper surface of a micro plate to be continuously fed, and pressing and heat- bonding it at a stroke to completely seal each small hole chamber in a short time, and prevent the film from being projected from its peripheral edge.
SOLUTION: A long heat-bonding film F having the width not larger than the width of a micro plate M to be fed out of a film feed part 2 is cut into a heat-bonding film piece Fa of the length not larger than the length of the micro plate M in a cutter part 4, the forward feed of the micro plate M by a micro plate carriage part 7 is synchronized with the feed o the heat-bonding film F, and a forward edge Fr of the heat-bonding film piece Fa is heat-bonded to a forward edge of the micro plate M to be fed and temporarily fixed thereto. In a heat-press part 5, a whole surface of the heat-bonding film piece to cover a full opening of a large number of small hole chambers on an upper surface of the micro plate M is pressed and heat-bonded, and each small hole chamber is sealed in a single step.
Inventors:
Yoshiki Yagi
Kunio
Takahiro Sugimoto
Shinji Ishida
Kunio
Takahiro Sugimoto
Shinji Ishida
Application Number:
JP19088499A
Publication Date:
February 23, 2004
Filing Date:
May 31, 1999
Export Citation:
Assignee:
Micronix Co., Ltd.
International Classes:
B65B7/16; B65B7/28; G01N35/04; (IPC1-7): B65B7/28
Domestic Patent References:
| JP1111405A | ||||
| JP52152070U | ||||
| JP4816235B1 |
Attorney, Agent or Firm:
Akira Koga
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