To provide a glass substrate for an electronic device capable of effectively utilizing merits of glass.

The glass substrate is manufactured by using the first process (ST1-ST3) for preparing coating film layers 2B on the front and back faces of a glass preform GV while leaving peripheral parts of used regions of the glass substrate which is partitioned into a plurality of areas, the second process (ST4) for forming cut grooves GV on the front and back faces of the glass preform by chemically polishing only peripheral parts where the coating film layer does not exist, the third process (ST5) for removing the coating film layers 2B in the stage that the cut grooves GV do not penetrate, and the fourth process (ST6) for thinning the glass preform and making the cut grooves GV penetrate by chemically polishing the whole of the glass preform which passed through the third process.