Title:
電子レンジ加熱耐性のある型焼き饅頭及びその製造方法
Document Type and Number:
Japanese Patent JP7490378
Kind Code:
B2
Abstract:
To provide a mold-baked Manju (bean paste bun) that does not produce texture deterioration of ingredients such as bean paste (dryness feeling of bean paste and heavy texture due to concentration of cream) even when reheated in a microwave oven, has a soft and moist skin, and has no contraction and good melting in the mouth, and, furthermore, to provide a wheat flour composition used in the production of mold-baked bean paste bun that has less deterioration in texture even in a state when overheated in a microwave oven, and a mold-baked bean paste bun in which said wheat flour is used.SOLUTION: A mold-baked bean paste bun wheat flour composition comprises a wheat flour obtained by milling a harvest of a wheat that does not lack the enzymatic activity of GBSSI-A1, lacks the enzymatic activity of GBSSI-B1 and GBSSI-D1 and lacks the enzymatic activity of any two of SSIIa-A1, SSIIa-B1 and SSIIa-D1.SELECTED DRAWING: None
Inventors:
Harumi Toda
Application Number:
JP2020020669A
Publication Date:
May 27, 2024
Filing Date:
February 10, 2020
Export Citation:
Assignee:
Nippon Flour Mills Co., Ltd.
International Classes:
A21D2/36; A21D10/02; A21D13/31; A23G3/34; A23G3/48; A23L7/10
Domestic Patent References:
| JP2013188206A | ||||
| JP2015033362A |
Attorney, Agent or Firm:
Shinichiro Tanaka
▲吉▼田 和彦
Hiroyuki Suda
Satsuki Ichikawa
Hironobu Hattori
Ji Akizawa
▲吉▼田 和彦
Hiroyuki Suda
Satsuki Ichikawa
Hironobu Hattori
Ji Akizawa
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