Title:
撮像素子パッケージ
Document Type and Number:
Japanese Patent JP7490377
Kind Code:
B2
Abstract:
An image sensor package includes an image sensor, a printed circuit board having a plurality of conductor layers, and a resin molded portion provided so as to surround an outer circumference of the printed circuit board. A first conductor layer among the plurality of conductor layers, which is closest to the resin molded portion has a dummy pattern formed along a circumference inside the resin molded portion.
Inventors:
Daisuke Toda
Application Number:
JP2020018130A
Publication Date:
May 27, 2024
Filing Date:
February 05, 2020
Export Citation:
Assignee:
Canon Inc
International Classes:
H01L23/02
Domestic Patent References:
| JP2016076669A | ||||
| JP2019192855A | ||||
| JP2016171203A |
Attorney, Agent or Firm:
Ryosuke Fujimoto
Atsuya Mizumoto
Tomoya Hirayama
Atsuya Mizumoto
Tomoya Hirayama