Title:
半導体素子および半導体素子形成用樹脂シート
Document Type and Number:
Japanese Patent JP7490376
Kind Code:
B2
Abstract:
To provide a semiconductor element that has a resin part having high resistance to a flux detergent.SOLUTION: A semiconductor element has a cured resin in which metal powder is dispersed and which includes a circuit inside, the cured resin being a reaction product between epoxy resin and diene rubber.SELECTED DRAWING: Figure 1
Inventors:
Daisuke Muramatsu
Application Number:
JP2020016161A
Publication Date:
May 27, 2024
Filing Date:
February 03, 2020
Export Citation:
Assignee:
Tomoekawa Corporation Co., Ltd.
International Classes:
C08L63/00; C08K3/01; C08L9/00; H01F17/04; H01L23/29; H01L23/31
Domestic Patent References:
| JP2016174142A | ||||
| JP2009295671A | ||||
| JP2015111576A |
Attorney, Agent or Firm:
Shunsuke Migita
Takahashi Politics
Takahashi Politics