Title:
MOLD OF CONCRETE SEGMENT AND ITS MANUFACTURING METHOD, MANUFACTURING METHOD FOR CONCRETE SEGMENT USING THE MOLD, AND CONCRETE SEGMENT MANUFACTURED BY THE MOLD
Document Type and Number:
Japanese Patent JP3473546
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To simplify a mold, and suppress the generation of noises when the mold is manufactured.
SOLUTION: First, a molding base 33 is molded by throwing a molding material into a reference base mold. Then, a reference board 51 which is molded conforming to the shape of a concrete segment to be manufactured is molded. On the reference board 51, a steel plate 55 to form the internal peripheral side molding surface of the concrete segment 51 is lined on the inner peripheral surface of the reference board 51. Then, a frame 52 for duplicating the reference board is attached along surfaces 51A and 51B which connect both of the inner and outer peripheral molding surfaces. Then, one section of the frame 52 for duplicating the reference board is connected to the molding base 33 through a supporting frame 43. Non-connected sections from among the frame 52 for duplicating the reference board are removed, and the reference board 51 is removed. Then, the frame 52 for duplicating the reference board is assembled again. To the frame 52 for duplicating the reference board, an upper frame 59 to form the outer peripheral side molding surface for the concrete segment is incorporated, and thus, a mold 50 is manufactured. In the mold, a fluid concrete is filled, and after curing the concrete, a demolding is performed to manufacture the concrete segment.
Inventors:
Shinichi Takano
Tomio Nakayama
Nobuaki Kobayashi
Sakae Takeshi
Takeshi Kawamoto
Tomio Nakayama
Nobuaki Kobayashi
Sakae Takeshi
Takeshi Kawamoto
Application Number:
JP2000096746A
Publication Date:
December 08, 2003
Filing Date:
March 31, 2000
Export Citation:
Assignee:
Taisei Yulek Co., Ltd.
Sun Mechanics Co., Ltd.
Taisei Corporation
Sun Mechanics Co., Ltd.
Taisei Corporation
International Classes:
E21D11/08; B28B1/14; B28B7/10; (IPC1-7): B28B7/10; B28B1/14; E21D11/08
Domestic Patent References:
JP852714A | ||||
JP3266605A | ||||
JP2000326319A | ||||
JP5367866U |
Attorney, Agent or Firm:
Mamoru Aikawa
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