Title:
MOLD RELEASABILITY IMPARTING COMPOSITION AND METHOD FOR MANUFACTURING MOLDED BODY
Document Type and Number:
Japanese Patent JP2014008612
Kind Code:
A
Abstract:
To provide a mold releasability imparting composition capable of effectively increase releasability when molding a molding material to obtain a molded body.
A mold releasability imparting composition 23 is used for imparting releasability on a surface of a metal mold 21 before molding a molding material 24 to obtain a molded body. The mold releasability imparting composition 23 includes: a thermosetting component; an inorganic filler; and a release agent. The release agent includes both fatty acid ester wax and oxidized or non-oxidized polyolefin wax.
Inventors:
SHIKAGE TAKASHI
HIGUCHI ISAO
FUKUDA TAKASHI
YASUI HIDEFUMI
MORITA TAKEHARU
WATANABE TAKASHI
NAKAMURA HIDE
HIGUCHI ISAO
FUKUDA TAKASHI
YASUI HIDEFUMI
MORITA TAKEHARU
WATANABE TAKASHI
NAKAMURA HIDE
Application Number:
JP2012144526A
Publication Date:
January 20, 2014
Filing Date:
June 27, 2012
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B29C33/62; B29C45/02; C08K3/36; C08L63/00; C08L91/06
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office