Title:
成形フィルムおよびその製造方法、成形体およびその製造方法
Document Type and Number:
Japanese Patent JP7473761
Kind Code:
B2
Abstract:
To provide a molded film that suppresses a decrease in conductivity due to tensile force and stress at high temperatures in a molding process, and has excellent ion migration resistance between conductive patterns even after molding.SOLUTION: There is provided a molded film having a conductive layer and an insulating layer on a base film, in which the conductive layer is a cured product of a conductive resin composition containing a resin (A1), a solvent (B1), and a conductive granule (C), the insulating layer is a cured product of an insulating resin composition containing a resin (A2) and a solvent (B2), the resin (A1) is a resin having a glass transition point of 10°C or higher and 110°C or lower and a weight average molecular weight of 10,000 or higher and 100,000 or lower, the resin (A2) is a resin having a glass transition point of 30°C or higher and 140°C or lower and a weight average molecular weight of 20,000 or higher and 200,000 or lower, and a volume resistivity of the insulating layer is 1×1010 Ω.cm or more and less than 1×1017 Ω.cm.SELECTED DRAWING: Figure 1
Inventors:
Tomoaki Harada
Yoshitaka Terashima
Yoshitaka Terashima
Application Number:
JP2020099286A
Publication Date:
April 24, 2024
Filing Date:
June 08, 2020
Export Citation:
Assignee:
artience Co., Ltd.
International Classes:
B32B7/025; B29C33/12; B29C45/14; B29C45/26; B29C51/10; B29C51/12; B32B27/18; H05K3/00; H05K3/20
Domestic Patent References:
| JP2020011502A | ||||
| JP2019102499A | ||||
| JP2010044998A | ||||
| JP2018061011A |
Foreign References:
| WO2019031393A1 |
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