Title:
成形フィルム、成形体およびその製造方法
Document Type and Number:
Japanese Patent JP7473762
Kind Code:
B2
Abstract:
To provide a molded film in which reduction of conductivity due to tensile force in a molding process and stress under high temperature is suppressed, and which has excellent ion migration resistance between conductive patterns even after molding.SOLUTION: A molded film for forming a printed conductive circuit coated by an insulator layer on a substrate surface having an uneven surface or a three-dimensional curved surface, in which the molded film is a molded film including a conductive layer and an insulator layer on a base film, the conductive layer is a cured product of a conductivity resin composition including resin (A1), conductive particles (D), and cross-linking agent (C1) if required, the insulator layer is a cured product of an insulating resin composition including the resin (A2) and the cross-linking agent (C2), the volume resistivity of the insulator layer is 1×1010 Ω cm or more and less than 1×1017 Ω cm, and the resin (A1) and the resin (A2) have a cross-linkable functional group that can react with the cross-linking agent (C2).SELECTED DRAWING: Figure 1
Inventors:
Yoshitaka Terashima
Hirokazu Tosaki
Hirokazu Tosaki
Application Number:
JP2020106522A
Publication Date:
April 24, 2024
Filing Date:
June 19, 2020
Export Citation:
Assignee:
artience Co., Ltd.
International Classes:
B32B7/025; B29C33/12; B29C45/14; B29C45/26; B29C51/10; B29C51/12; B32B27/18; H05K3/00; H05K3/20
Domestic Patent References:
| JP2020011502A | ||||
| JP2019102499A | ||||
| JP2009144072A | ||||
| JP10180924A | ||||
| JP2019189680A |