Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLDING DIE FOR SEALING RESIN, AND ITS SURFACE TREATING METHOD
Document Type and Number:
Japanese Patent JP2006231843
Kind Code:
A
Abstract:

To provide a molding die for sealing a resin controlling a demolding balance when demolding a work form the molding die after sealing the resin and its surface treating method.

A hard chrome plating for example of a friction coefficient of 0.8 is applied to the surface of a first metal surface 3 and a chrome nitride plating for example of a friction coefficient of 0.5 is applied to the surface of a second metal surface 4 as a surface treatment for enhancing demoldability on the surfaces of the first and second mold cavities 5, 6 from which the work is required to be demolded, thereby the work can be taken out without depending on the mechanical ejector by changing the demolding resistance of the work, a mold structure can be simplified by changing the balance of the friction resistance of the first metal surface 3 and the second metal surface 4 even in the case that mechanical demolding is difficult, designing of the mold can be easily done, a complicated ejector mechanism can be simplified to be able to provide inexpensive molds.


Inventors:
KANEMITSU YASUO
KOGA AKIRA
Application Number:
JP2005052964A
Publication Date:
September 07, 2006
Filing Date:
February 28, 2005
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B29C33/38; B29C45/14; H01L21/56
Attorney, Agent or Firm:
Mitsutake Murayama