To improve the quality of junction with a printed board by easily measuring the shape and the quantity, respectively, of the bump made at the electrode of a flip chip part and the conductive adhesive at the top of the bump, in a mounter for the flip chip part.

This mounter is equipped with a CCD camera 1 which picks up the image of the side face form of a bump 10, and the first image processor 3 and the second image processor 4 which operate the height and width of the bump 120 and the semicircular form of the bump 10 from the side face form of the bump 10 before and after the transcription of a conductive adhesive 11 photographed by the CCD camera 1, and the quantity of transcription of the conductive adhesive 11 is measured from the computation data of the second image processor 4 and the computation data of the first image processor 3, and when the quantity of this transcription fulfills the preset tolerance, this flip chip part 9 is mounted on a printed board. Therefore, when mounting the flip chip part 9 on the printed board, the quality of junction can be improved.