PURPOSE: To mount rapidly an electronic component without making the electronic component interfere with an electronic component, which is already inserted, and without making the electronic component, which is already inserted, interfere with chucking pawls and so on and to contrive the improvement of the efficiency of a mounting device by a method wherein the electronic component, which is already inserted, is inclinedly brought down on the side of the rear of a printed substrate and an inserting space is secured.

CONSTITUTION: Leads 19 of an electronic component 18, which is already inserted, are pushed to their respective lateral directions by press pawls 27 on the side of the rear of a printed substrate 11 and the main body part of the component 18 is inclinedly brought down. In short, by pressing the leads 19 of the component 18, which is already inserted, the main body part is expanded to the outside, the component 18 is retreated and an inserting space 40 is secured between electronic components 18. After the space 40 is formed on the substrate 11, an inserting head 15 of a component inserting mechanism 12 is made to descend. Whereupon, an electronic component 18 chucked by chucking pawls 16 is inserted in the space 40. At this time, the component 18 can be easily inserted without making the component 18 and the pawls 16 interfere with the component 18 which is already inserted.