Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOUNTING METHOD FOR ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH0210898
Kind Code:
A
Abstract:

PURPOSE: To omit a wasteful operation and to improve an electronic component mounting efficiency by recognizing the shape of the component before the component is sucked by a suction nozzle, abandoning the component as it is when mounting is improper, and immediately disposing oppositely a next electronic component.

CONSTITUTION: A mounting head 21 is disposed above the sucking position of a component supply unit 23, and the shape of an electronic component P of its sucked position is recognized by a recognition camera 18 through a suction nozzle 1 and a light transmission plate 5. If a defect 27 is provided on the component P or the lead of a component with leads is lacked or bent in an inadequate shape, its sucking operation is not started, but a part cassette 26 is operated as it is, a next electronic component P is fed to a sucking position, and its shape is again recognized by the camera 18. If the shape of the component P is proper, the component P is sucked by the nozzle 1, the sucked component P is disposed above a predetermined mounting position of a circuit board 24, and accurately mounted at a predetermined position on the board 24.


Inventors:
IZUMI YASUO
ISHIMOTO KAZUMI
MAKINO YUTAKA
Application Number:
JP16160688A
Publication Date:
January 16, 1990
Filing Date:
June 29, 1988
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K13/04; H05K13/08; (IPC1-7): H05K13/04; H05K13/08
Attorney, Agent or Firm:
Toshio Nakao (1 outside)