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Patent Searching and Data


Title:
DEVICE FOR MOUNTING OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH0210899
Kind Code:
A
Abstract:

PURPOSE: To improve the response of sucking and releasing of sucking and to mount an electronic component at a high speed by recognizing the position, shape of the component to be sucked by a suction nozzle through the nozzle and a light transmission plate, and forming a suction chamber partitioned by the plate adjacent to the nozzle.

CONSTITUTION: A mounting head 30 is disposed above the sucking position of a component supply unit 32, and the shape of an electronic component P of sucked position is recognized by a recognition camera 23 through a suction nozzle 1 made of a light transmission material and a light transmission plate 5. If the shape of the component P is proper, a moving table 31 is moved down, and the component P is sucked by the nozzle 1. In this case, the upper end of a suction cylinder 3 is shielded by this plate 5 to partition a suction chamber 6, and a plurality of suction openings 7 are formed at a suitable interval circumferentially on the peripheral sidewall. Thus, the capacity of a suction passage is reduced, the response of suction and release of the suction is improved, and a high speed mounting is performed.


Inventors:
IZUMI YASUO
ISHIMOTO KAZUMI
MAKINO YUTAKA
Application Number:
JP16160788A
Publication Date:
January 16, 1990
Filing Date:
June 29, 1988
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K13/04; (IPC1-7): H05K13/04
Attorney, Agent or Firm:
Toshio Nakao (1 outside)