PURPOSE: To make it possible to omit a cutting process by using a spacer to lift a lead type electronic part itself in mounting the part.

CONSTITUTION: With conventional methods, there is only a slight gap (x) between a multipin IC 202 for printer drive and an electrolytic capacitor 205 mounted on a print control printed board 113, which can lead to shorts. To cope with this, a spacer 206 is placed in-between to increase the gap by the thickness (y) of the spacer 206 to x+y. This increases the gap between electronic parts, and prevents such accidents as shorts between them. It also makes unnecessary a process for cutting the excess of lead terminals, and can reduce man-hour. Further, the disuse of the cutting process eliminates the disposal of chips, and makes unnecessary cleaning processes involving CFCs, which contributes to the preservation of environment. Risk of shorts due to chips is naturally eliminated, and the reliability of printed boards is improved.