To provide a mounting method of a semiconductor, which is able to comply with miniaturization of a connecting pitch and to perform stable connecting and moreover anisotropic conductive bonding agent used in the this method.

This method consists of following processes. In a first process, anisotropic conductive bonding agent 13 including solder particles 12 is arranged on a circuit board 17. In a second process, projecting electrode 14 provided on a semiconductor device 16 is aligned with the position of a wiring pattern 15 on the circuit board 17. In a third process, the mounted semiconductor device 16 is thermally pressed to the circuit board 17 with a heating and compressing jig 18. In a fourth process, the heating and compressing jig 18 is removed after the anisotropic conductive bonding agent 13 is hardens.