Title:
MOUNTING STRUCTURE FOR PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2674586
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a mounting structure for a printed wiring board in which all leads of an SMD(surface mount device) can be used while promoting the absorption of thermal strain between a printed board and an SMD package.
SOLUTION: Lower part of an SMD package 1 is arranged on a printed board 7 and a slot 4 is made in the outer circumference thus making a recess at the part for mounting the SMD package 1. A plurality of land forming parts 3, corresponding to respective outer circumferential sides of the SMD package 1, are then projected independently from the bottom part of the recess. The lead 2 is connected electrically with a wiring pattern 8 on the printed board 7 through a V-shaped metal line 5 with the majority thereof being contained in the slot 4.
Inventors:
Tatsuji Moriguchi
Application Number:
JP27607295A
Publication Date:
November 12, 1997
Filing Date:
October 25, 1995
Export Citation:
Assignee:
NEC
International Classes:
H05K1/18; H05K1/02; H05K3/34; (IPC1-7): H05K1/18; H05K1/02
Domestic Patent References:
| JP595179A | ||||
| JP5335715A | ||||
| JP60217692A |
Attorney, Agent or Firm:
Yanagi Kawa Shin
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