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Title:
MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3847250
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To solve the problem wherein a structure for mounting a semiconductor device on an external electric circuit board is much deteriorated in properties of transmitting electric signals due to reflections or the like when high-frequency electric signals are transmitted, wherein the semiconductor device is composed of a semiconductor element transmitting/receiving high-frequency electric signals and a package for housing the semiconductor element airtightly.
SOLUTION: The semiconductor element 6 transmitting/receiving electric signals having frequencies of 40 to 80 GHz is housed in a package for the formation of a semiconductor device 11 equipped with an input/output pad 3a which is connected to a semiconductor element 6 and located on its undersurface. The mounting structure of the semiconductor device 11 is that the semiconductor device 11 is mounted on an external electric circuit board 12 as the input/output pad 3a is connected to a circuit conductor 13 of the external electric circuit board 12 through the intermediary of a conductive connecting material 14. The input/output pad 3a is 0.196mm2 or below in plane area, and the gap between the semiconductor device 11 and the external electric circuit board 12 is filled up with a resin filler 15.


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Inventors:
Shin Matsuda
Tetsuo Hirakawa
Yoshinobu Sawa
Hisayoshi Wada
Application Number:
JP2002339919A
Publication Date:
November 22, 2006
Filing Date:
November 22, 2002
Export Citation:
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Assignee:
Kyocera Corporation
International Classes:
H01L23/12; H01L23/29; H01L21/60; H01L23/31; (IPC1-7): H01L23/12; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
JP2002151621A
JP2001168443A
JP2002164466A
JP11312747A
JP2000188359A
JP11186455A
JP118334A
JP10247706A
JP2004158576A
JP2004158575A



 
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