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Title:
半導体レーザー装置の取付構造
Document Type and Number:
Japanese Patent JP4363016
Kind Code:
B2
Abstract:

To easily mount a semiconductor laser device which has a surface light emitting semiconductor laser chip as a laser light source on a support structure mounted with an imaging optical system and to make the inclination error sufficiently small for the laser light source to the imaging optical system.

When the semiconductor laser 14 is mounted on a light source mounting part 93, a screw 100 inserted into an insertion hole 84 of a printed wiring board 80 is fastened in a screw hole 98 of a light source mounting part 93 and a 2nd reference surface 74 of a package member 68 is made to abut against a mounting reference surface 97 of a support base 96 across the printed wiring board 80. In this state, a position adjustment and a phase adjustment of a laser array 60 along an X-Y plane are made and then the screw 100 is clamped into the screw hole 98 until specified clamping torque is generated, thereby constraining the movement and rotation of the semiconductor laser 14 along the X-Y plane.

COPYRIGHT: (C)2004,JPO


Inventors:
Sakakibara Takaaki
Takumi Shimizu
Fumiya Hisa
Application Number:
JP2002274444A
Publication Date:
November 11, 2009
Filing Date:
September 20, 2002
Export Citation:
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Assignee:
Fuji Xerox Co., Ltd
International Classes:
G02B26/10; H01S5/022
Domestic Patent References:
JP2003503858A
JP2002026445A
JP2001228382A
JP2002267893A
JP2000252577A
JP2001308436A
Foreign References:
WO2001001497A1
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda



 
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