Title:
MOUNTING STRUCTURE FOR SENSOR
Document Type and Number:
Japanese Patent JP3661309
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a mounting structure by which the connection of an external application circuit to a multisize sensor can be performed simply and surely via a general connector, for a board, of high reliability in a sensor (the multisize sensor) devised to generate an output according to a pressurization position when a beltlike sensor face is pressurized partially.
SOLUTION: A slender printed-wiring board 4 of large rigidity is used as a board, slender sheetlike sensors 6, 7, 8 which are shorter than the board are bonded onto the board, wiring patterns which are printed and formed on one end side of the printed-wiring board 4 are connected to wiring patterns of the sheetlike sensors, and a connector, for a board, which is connected to the printed patterns of the printed-wiring board 4 is mounted on one end part of the printed-wiring board.
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Inventors:
Kazuhiko Hanaki
Toshihide Tanaka
Toshihide Tanaka
Application Number:
JP27529896A
Publication Date:
June 15, 2005
Filing Date:
September 27, 1996
Export Citation:
Assignee:
OMRON Corporation
International Classes:
G01B7/00; G01B21/00; G01D5/16; (IPC1-7): G01B7/00; G01B21/00; G01D5/16; H01R12/16
Domestic Patent References:
| JP8212869A |
Attorney, Agent or Firm:
Shinichi Matsui