PURPOSE: To enable a logic circuit element provided with a large number of terminals and a large number of memories to be easily superposed and to enlarge a multilayer type multichip semiconductor device in scope of application by a method wherein semiconductor elements connected through a tape carrier method are connected to a multilayer printed wiring board provided with through-holes, and the printed wiring board is made to serve as a spacer.
CONSTITUTION: Semiconductor chips are electrically connected to a film carrier tape, and two or more semiconductors are superposed interposing a multilayer printed wiring board 9 as a spacer between them to constitute a multilayer type semiconductor module. That is, a logic circuit element provided with a large number of non-common terminals and a large number of memories are using a multilayer printed wiring board as a spacer 9. By this setup, semiconductor elements can be freely superposed independent of their kinds, and these elements can be mixedly mounted, so that the superposed semiconductor elements can be used as a multilayer type multichip semiconductor device wide in a scope of application, and moreover a process where outer leads are formed and cut off can be dispensed of, in result a multilayer type multichip semiconductor device can be manufactured at a low cost.
SAKAGUCHI MASARU
SERIZAWA KOJI
ISHIDA TOSHIHARU
MIYANO ICHIRO
