Title:
MULTILAYER CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR AND MOUNTING BOARD
Document Type and Number:
Japanese Patent JP2014212291
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To solve such a problem that a multilayer ceramic electronic component, having a thickness larger than the width, falls when it is mounted on a circuit board.SOLUTION: A multilayer ceramic electronic component includes a ceramic body having a plurality of dielectric layers laminated in the thickness direction and satisfying a relation of T/W>1.0, where W is the width and T is the thickness, a plurality of first and second internal electrodes arranged to face each other via the dielectric layer in the ceramic body and exposed alternately from both end faces of the ceramic body, and first and second external electrodes formed on both end faces of the ceramic body and electrically connected with the first and second internal electrodes respectively. The ceramic body is divided into five regions in the width direction, and the difference of electrode connectability between a central region and both side regions, i.e., (CW2 or CW3)-CW1, is in a range of 0.02-0.10, where CW1 is the central region out of the five regions and CW2 and CW3 are both side regions of the CW1.
Inventors:
LEE MIN GON
ONO MASAAKI
KIM JONG HAN
LEE SEUNG HO
ONO MASAAKI
KIM JONG HAN
LEE SEUNG HO
Application Number:
JP2013128181A
Publication Date:
November 13, 2014
Filing Date:
June 19, 2013
Export Citation:
Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H01G4/30; H01G2/06; H01G4/12; H01G4/232
Attorney, Agent or Firm:
Koen Kato
Fukukawa 晋矢
Fukukawa 晋矢