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Patent Searching and Data


Title:
MULTILAYER CIRCUIT BOARD SINTERED IN TWO-DIMENSIONAL ATMOSPHERE
Document Type and Number:
Japanese Patent JPH025595
Kind Code:
A
Abstract:

PURPOSE: To reduce consumption of materials in the manufacturing process of thick film circuit boards by forming a resistance measuring electrode at the same time and with the same material as a lower conductor to thereby allow a resistance of a ruthenium oxide containing resistor to be measured before forming an upper conductor.

CONSTITUTION: A resistance measuring electrode 6 is formed at the same time and with the same material as a lower conductor 1 on alumina 5, and the resistance measuring electrode 6 is electrically connected with a ruthenium oxide containing resistor 4 after the formation of an insulabor layer 2. This allows the resistance of the ruthenium oxide containing resistor 4 to be measured before forming an upper conductor 3, whereby material consumption during the manufacturing process of thick film circuit boards may be reduced. Further, since the upper conductor 3 is electrically connected to the resistance measuring electrode 6, its equivalence with the connection through via holes can be maintained.


Inventors:
NAKANO KATSUHIRO
Application Number:
JP15716388A
Publication Date:
January 10, 1990
Filing Date:
June 24, 1988
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K3/46; (IPC1-7): H05K3/46
Attorney, Agent or Firm:
Toshio Nakao (1 outside)