PURPOSE: To obtain a multilayer circuit board by providing a through hole larger toward its upper layer on a board except a circuit board of a lowermost layer, forming a protrusion passing the hole of the uppermost layer the same as its upper end face, and providing a connecting terminal.

CONSTITUTION: Wirings 33 of a board 30 of an upper layer is connected to the electrode pad of a component 40 through a connecting terminal 34, and the wiring pattern 23 of a board 20 of a lower layer is connected to the electrode pad of the electronic component 40 through a connecting terminal 24 formed on the upper end face of a corresponding protrusion 21. Accordingly, an interlayer connecting through hole is eliminated, an increase in the density of the patterns 33, 23 can be easily processed, and even if the upper and lower boards are slightly deviated, the connecting reliability with the component 40 is not lost. When the laminated and secured board is formed of a wiring pattern on a polyimide film by a photolithographic technique, the increase in the number of pins of the component can move easily be processed.