PURPOSE: To decrease the numbers of electronic components which are mounted on the surface of a multilyaer printed wiring board by a method wherein an opening is provided to a printed wiring board which is, at least, not the outermost board and inside a multilayer printed wiring board, and an electronic component is buried in it.

CONSTITUTION: An opening is provided to the surface of an insulating board, an electronic component 1 such as a condenser or the like is buried in the opening, and printed wiring substrates 3 provided with a wiring pattern 2 which is connected with the electronic component 1, are laminated on the insulating board to form a multilayer printed wiring board. And, a through-hole 4 is provided in such a manner that it extends from the surface of multilayer printed wiring board and reaches to the wiring pattern of the printed wiring board 3. The leads of the electronic component 5 such as an IC or the like are connected to the through-holes 4 to package an electronic component.