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Title:
MUTUAL SURFACE ADHESION METHOD BETWEEN DIFFERENT SEALING COMPOUNDS
Document Type and Number:
Japanese Patent JP2002206290
Kind Code:
A
Abstract:

To provide a method firmly adhering an interface between a silicone system sealing compound and the other sealing compound.

A different sealing connection plate applying primers 2' and 3' applicable to each of other sealing compounds on both sides of a bevel joint- shaped plate 1 corresponding to the width and the depth of a joint is set in the joint section at a position crossing the silicone system sealing compound 3 and the other sealing compound each other, and after it is attached to the preceding sealing side by pressure, the post-casting different (silicone system or the like) sealing is similarly filled and attached to the connection plate side by pressure to prevent different sealing hardening bodies from coming into contact with each other, so that no adhesive fracture occurs, the different sealing is firmly adhered to the plate side through the connection plate, a cause to prevent the adherence of the other sealing interface to the silicone hardening bodies is eliminated, and a water leak phenomenon resulted from it can be prevented.


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Inventors:
SUGIYAMA OSAMU
Application Number:
JP2001037704A
Publication Date:
July 26, 2002
Filing Date:
January 09, 2001
Export Citation:
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Assignee:
BIRUKEN KK
International Classes:
E04B1/682; (IPC1-7): E04B1/682